The **ATS-H1-76-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from Advanced Thermal Solutions (ATS). It belongs to the "maxiFLOW™" series, designed to provide high thermal performance in environments with constrained airflow. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.50 °C/W (@ 100 LFM) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 14.50mm | --- ### 2. Key Components & Design The "Electronic Part" functionality of this device is passive, focusing on heat dissipation for semiconductors (CPUs, FPGAs, or GPUs). #### A. The Fin Design (maxiFLOW™) * **Tapered Fins:** The fins are designed with a graduated profile to maximize surface area while minimizing pressure drop. * **Directionality:** It is a directional heat sink, meaning it is optimized for airflow coming from a specific side to sweep heat away from the base effectively. #### B. The pushPIN™ Attachment System Unlike simple adhesive tapes, this part uses a mechanical attachment system: * **Hardware:** Includes a brass/stainless steel pin and a high-performance compression spring. * **Reliability:** Provides consistent pressure (TIM compression) across the component surface, ensuring better thermal contact than clip-on or tape-based heat sinks. #### C. Thermal Interface Material (TIM) * **Pre-Applied:** This specific model typically comes with **ATS-CPX-1010-P0** (a high-performance thermal pad or phase-change material) pre-applied to the base to bridge the microscopic air gaps between the chip and the aluminum. --- ### 3. Application Use Cases This part is commonly found in the following electronic assemblies: * **Networking Gear:** Routers and switches where high-speed processors generate significant heat. * **Embedded Systems:** Industrial PCs where mechanical stability (vibration resistance) is required via the pushPIN mount. * **Power Supplies:** Cooling MOSFETs or power conversion ICs. ---