The **ATS-H1-82-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide high-efficiency cooling for electronic components like CPUs, GPUs, and ASICs. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (with Blue Anodized finish) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 36.83mm x 41.21mm x 14.48mm | | **Fin Style** | High-performance MaxiFLOW (spread fin) | | **Thermal Resistance** | 3.51°C/W (@ 200 LFM) | | **RoHS Status** | Compliant | --- ### 2. Key Electronic & Mechanical Features #### A. The pushPIN™ Attachment System This part uses a specific mechanical mounting system called **pushPIN™**. This is critical for electronic assemblies because: * It provides **precise pressure**: Ensures optimal contact between the heat sink and the electronic component (TIM - Thermal Interface Material). * **Vibration Resistance**: The spring-loaded mechanism prevents the heat sink from shifting during transport or operational vibration. #### B. maxiFLOW™ Fin Geometry Unlike standard extruded heat sinks, the maxiFLOW design features a flared fin pattern. This is engineered to: * Increase the surface area for heat dissipation. * Reduce **pressure drop**, allowing more airflow from system fans to pass through the fins effectively. #### C. Thermal Interface Material (TIM) The "C2" in the part number typically indicates that the heat sink comes pre-applied with **ATS-54** (a high-performance thermal grease) or a specific phase-change material. This ensures that the microscopic air gaps between the semiconductor die and the metal base are filled, maximizing heat transfer. --- ### 3. Application Use-Cases This specific heat sink is commonly found in: 1. **Telecommunications**: Cooling high-speed networking chips. 2. **Industrial PCs**: Heat dissipation for embedded processors. 3. **Power Supplies**: Management of heat for voltage regulators and power MOSFETs.