The **ATS-H1-84-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "maxiFLOW" product line, designed to dissipate heat from electronic components like CPUs, GPUs, FPGAs, and power modules. --- ### ## Technical Specifications Below are the primary electronic and physical specifications for the ATS-H1-84-C2-R0: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Thermal Resistance** | 2.50°C/W (at 200 LFM) | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Dimensions (L x W x H)** | 37.00mm x 37.00mm x 15.00mm | | **Base Style** | Square | | **Thermal Interface Material (TIM)** | Saint-Gobain C675 (Pre-applied) | --- ### ### Key Electronic Components & Design Features #### 1. Heat Sink Geometry (maxiFLOW™) The "maxiFLOW" design features a flared fin structure. In electronic applications, this geometry is critical because it reduces the pressure drop of the air flowing through the fins, allowing for higher thermal efficiency in systems with high-density component placement. #### 2. Attachment System (maxiGRIP™) The "R0" suffix denotes the specific attachment mechanism. The **maxiGRIP** system consists of: * **Plastic Frame Clip:** A high-strength clip that snaps onto the component without requiring holes in the PCB. * **Metal Spring Clip:** A "steady-state" spring that applies constant pressure to ensure consistent contact between the heat sink and the chip, preventing air gaps that cause overheating. #### 3. Thermal Interface Material (TIM) The unit comes pre-applied with **Saint-Gobain C675**. In electronic circuits, the TIM is vital because it fills the microscopic air gaps between the component's silicon/package and the metal heat sink, significantly lowering the junction-to-ambient temperature ($T_{JA}$). #### 4. Material Conductivity Constructed from 6063 aluminum, this part is designed for high thermal conductivity while remaining lightweight, ensuring it does not put excessive mechanical stress on the BGA (Ball Grid Array) solder joints of the underlying electronic chip. --- ### ### Applications * **Networking:** Routers, switches, and telecommunication hardware. * **Computing:** Embedded systems and industrial PC motherboards. * **Power Electronics:** Voltage regulators and high-speed data processing units.