The **ATS-H1-85-C2-R0** is a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "high-performance" line designed specifically for cooling electronic components such as CPUs, GPUs, FPGAs, and high-density power modules. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 15.00mm | | **Attachment Method** | Push-Pin (2-pin design) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Thermal Resistance** | ~1.60 °C/W (at 200 LFM) | --- ### 2. Key Features and Design #### A. Fin Geometry The "H1" series typically utilizes a **straight-fin** or **cross-cut** design. This is optimized for uni-directional or multi-directional airflow, ensuring that heat is dissipated efficiently from the base plate to the surrounding air. #### B. Push-Pin Attachment The **-R0** suffix indicates a specific hardware configuration. This part uses a standardized push-pin mounting system: * **Reliability:** Ensures consistent pressure on the component (IC), improving thermal contact. * **Ease of Install:** Requires pre-drilled holes in the PCB; no tools are generally needed for the plastic pin versions. #### C. Thermal Interface Material (T766) The part comes with **T766** pre-applied to the base. This is a high-performance phase-change or grease-like material that fills microscopic air gaps between the heat sink and the electronic chip, significantly lowering thermal impedance. --- ### 3. Application Use Cases This heat sink is sized for medium-to-large integrated circuits. Common applications include: * **Networking Hardware:** High-speed routers and switches. * **Embedded Computing:** Industrial PC processors. * **Telecommunications:** Base station power amplifiers or signal processors. --- ### 4. Thermal Performance Comparison (Estimated) *Note: Performance varies based on Airflow (LFM - Linear Feet per Minute).* | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 1.60 | | 400 | 1.10 | | 600 | 0.85 |