The **ATS-H1-87-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components like CPUs, GPUs, FPGAs, and high-power ASICs. Below is a detailed breakdown of its electronic and mechanical specifications. --- ### 1. General Specifications The part belongs to the **maxiFLOW™** series, known for its unique flared fin structure which maximizes surface area for air cooling. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-H1-87-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | ~2.70°C/W (at 200 LFM) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the PCB layout without interfering with surrounding electronic parts. * **Length (L):** 37.00 mm * **Width (W):** 37.00 mm * **Height (H):** 20.00 mm * **Pitch:** 1.57 mm (referring to the mounting hole pattern) --- ### 3. Thermal Performance The efficiency of this electronic part depends on the airflow (LFM - Linear Feet per Minute). As airflow increases, the thermal resistance decreases, allowing the component to run cooler. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 4.60 | | 200 | 2.70 | | 300 | 2.10 | | 400 | 1.80 | --- ### 4. Mounting and Interface Electronic reliability is highly dependent on how the heat sink is attached to the PCB. * **Attachment:** It uses the **pushPIN™** system. This consists of a brass or plastic pin with a stainless steel spring that provides a specific pressure to ensure a secure fit and optimal contact with the electronic component. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766**, a high-performance thermal phase-change material or grease that fills microscopic air gaps between the chip and the heat sink. --- ### 5. Application Use Cases * **BGA Cooling:** Ideal for Ball Grid Array packages. * **Power Supplies:** Used in high-density DC-DC converters. * **Telecommunications:** Cooling of networking processors in switches and routers. ---