ATS-H1-96-C2-R0
AI

The **ATS-H1-96-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed for cooling electronic components such as processors, FPGAs, and ASICs.
### 1. Technical Specifications
The following table highlights the key physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Material** | Aluminum (Extruded) |
| **Thermal Resistance** | 0.96 °C/W @ 200 LFM |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 57.00mm x 57.00mm x 25.00mm |
| **Finish** | Blue Anodized |
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### 2. Key Components & Design Features
The "electronic" functionality of this part is purely passive, serving as a heat exchanger to protect active circuitry from thermal failure.
* **maxiFLOW™ Fin Geometry:** The fins are designed with a tapered base and a flared top. This increases the surface area for heat dissipation while reducing the pressure drop of the airflow, making it highly efficient in forced-convection environments (fans).
* **pushPIN™ Attachment:** Instead of messy adhesives, this part uses a mechanical push-pin system with a pre-assembled compression spring. This ensures a consistent "clamping force" on the electronic chip, which optimizes the thermal interface.
* **Thermal Interface Material (TIM):** This specific model usually comes with **SAINT-GOBAIN C700** or a similar high-performance thermal pad pre-applied to the base to ensure zero air gaps between the component and the heat sink.
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### 3. Application Use Cases
This part is commonly used in high-density electronic assemblies where space is limited but heat output is high:
1. **Networking Hardware:** Switches, routers, and base stations.
2. **Power Supplies:** Cooling MOSFETs or power regulators.
3. **Industrial Computing:** Embedded systems that run under high workloads for extended periods.
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### 4. Part Number Breakdown (Nomenclature)
`ATS` - **Advanced Thermal Solutions**
`H1` - **Heat Sink Series Type**
`96` - **Thermal Performance Metric**
`C2` - **Material/Finish Code** (Blue Anodized)
`R0` - **Revision/Packaging Code**
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What is the difference between push-pin and adhesive mounting for heat sinks?
- ⤷ How does 'LFM' (Linear Feet per Minute) affect the thermal resistance of this part?
- ⤷ Can this heat sink be used for passive cooling without a fan?