The **ATS-H1-97-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, and power modules. --- ### 1. Key Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and thermal interface material. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ Heat Sink Assembly | | **Heat Sink Type** | Straight Fin (High Performance) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the PCB layout without interfering with surrounding capacitors or connectors. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 10.00 mm * **Pitch (Fin spacing):** Designed for high-density airflow. --- ### 3. Thermal Performance Thermal resistance is measured in °C/W (Degrees Celsius per Watt). The lower the number, the more efficient the cooling. | Airflow Velocity (LFM) | Thermal Resistance (Unducted) | | :--- | :--- | | 100 (0.5 m/s) | 20.30 °C/W | | 300 (1.5 m/s) | 8.70 °C/W | | 500 (2.5 m/s) | 5.30 °C/W | --- ### 4. Components of the Assembly The "H1" and "C2" codes in the part number refer to the mounting hardware and material types: 1. **Aluminum Body:** Lightweight and offers excellent thermal conductivity. 2. **Push-Pins:** Plastic or brass pins that lock into standard PCB holes (typically 3.0mm holes). 3. **Compression Springs:** Provide consistent "Force-on-Die" to ensure the heat sink remains in contact with the component during mechanical shock. 4. **T766 TIM:** A phase-change or high-conductivity thermal paste pre-applied to the base to eliminate air gaps between the chip and the metal. --- ### 5. Application Use Cases * **Telecommunications:** Cooling of high-speed network switches. * **Embedded Systems:** For industrial PCs where vertical space (10mm height) is limited. * **Power Supplies:** Heat dissipation for MOSFETs and DC-DC converters.