The **ATS-P1-06-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" series, designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Product Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 10mm | | **Pitch** | Fine-Pitch (increases surface area) | | **Thermal Resistance** | ~20.27°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Core Components and Design The "Electronic" functionality of this part is passive, serving to protect active electronics from thermal failure through several design features: #### A. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the heat sink comes pre-applied with **ATS-91**, a high-performance thermal interface material. This ensures minimal air gaps between the heat source (CPU/GPU/FPGA) and the aluminum base. #### B. pushPIN™ Attachment Unlike adhesive tapes that can fail under high heat, this part uses a mechanical **Push Pin** system with a built-in spring. * **Pressure:** The spring provides precise, consistent pressure across the component surface. * **Reliability:** It prevents the heat sink from shifting during mechanical shock or vibration. #### C. Fin Geometry The fin design is optimized for "Fine-Pitch" airflow. This means the fins are spaced to maximize the surface area for heat dissipation while maintaining compatibility with standard electronic enclosure fans. --- ### 3. Typical Applications This specific heat sink is commonly found in the following electronic environments: * **Telecommunications:** Cooling networking switches and routers. * **Embedded Systems:** Protecting microprocessors on PCB boards. * **Power Supplies:** Dissipating heat from high-speed transistors or voltage regulators. * **Industrial Controls:** Ensuring stability in high-ambient temperature settings. --- ### 4. Thermal Performance Overview Thermal resistance varies based on the airflow (velocity) within the electronic chassis: | Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 20.27 | | 300 | 1.5 | 6.45 | | 500 | 2.5 | 3.73 | | 700 | 3.5 | 2.72 |