The **ATS-P1-154-C3-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their "maxiFLOW™" series of high-performance heat sinks designed for cooling integrated circuits (ICs) and other electronic components. --- ### Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-P1-154-C3-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 7.61°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Weight** | ~40 grams | --- ### Key Electronic & Mechanical Features #### 1. Heat Sink Design (maxiFLOW™) The "maxiFLOW" design features a flared fin structure. This geometry is engineered to maximize surface area and increase the effectiveness of convection cooling in environments where there is low-to-moderate airflow. #### 2. Thermal Interface Material (TIM) The part comes pre-applied with **T412**, which is a high-performance phase-change material. This ensures that the microscopic gaps between the electronic chip (CPU/FPGA) and the heat sink are filled, minimizing thermal resistance. #### 3. Attachment System (pushPIN™) Instead of adhesive tape, this part uses a **pushPIN™** system. * **Advantage:** Provides consistent pressure on the electronic component, which improves heat transfer. * **Hardware:** Includes a brass/plastic pin and a stainless steel spring to lock the heat sink into pre-drilled holes on the PCB (Printed Circuit Board). #### 4. Material Selection (AL6063) Aluminum 6063 is used because it offers a high thermal conductivity-to-weight ratio. The **Blue Anodized** finish is not just for aesthetics; it provides a layer of protection against corrosion and slightly increases emissivity for radiation cooling. --- ### Common Applications This part is typically used for cooling the following electronic components: * **CPUs and Microprocessors** in industrial computers. * **FPGAs and ASICs** in networking equipment. * **Power Modules** that generate significant heat in a small footprint.