The **ATS-P1-165-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to provide high-efficiency cooling for electronic components like processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table outlines the core electronic and physical attributes of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 11.83°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 10mm | | **Pressure Drop** | High-efficiency fin design | | **Compliance** | RoHS and REACH compliant | --- ### 2. Design Characteristics The part is engineered for high-density electronic assemblies where space is limited but heat dissipation is critical. * **maxiFLOW™ Geometry:** Features a tapered fin design that increases the surface area while reducing pressure drop, allowing air to flow through the sink more effectively. * **pushPIN™ Attachment:** This system includes a pre-assembled spring and pin that ensures the heat sink is held firmly against the component with consistent pressure, optimizing the thermal interface. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal pad that fills microscopic air gaps between the component and the heat sink. --- ### 3. Electronic Performance Data Thermal resistance determines how well the part moves heat away from the electronics. Performance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.83 | | 200 (1.0 m/s) | 8.24 | | 400 (2.0 m/s) | 6.01 | | 600 (3.0 m/s) | 5.09 | --- ### 4. Typical Applications This component is used to protect sensitive electronic parts from thermal throttling or permanent damage in: * Network switches and routers. * Embedded computing boards. * Industrial power supplies. * High-speed data communication modules.