The **ATS-P1-176-C2-R0** is a specific electronic component within the thermal management category. It is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**, specifically part of their "maxiFLOW" series. --- ### Technical Specifications The following table outlines the physical and thermal characteristics of the device: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-P1-176-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Thermal Resistance** | 6.73°C/W (at 100 LFM) | | **Flow Pattern** | maxiFLOW (Tapered Fin Design) | | **Base Shape** | Square | --- ### Component Breakdown #### 1. maxiFLOW™ Fin Geometry The "P1" in the part number signifies the use of ATS's proprietary **maxiFLOW** technology. Unlike standard straight-fin heat sinks, these fins are tapered. This design: * Reduces pressure drop across the heat sink. * Increases the surface area for heat dissipation. * Optimizes airflow in constrained spaces. #### 2. pushPIN™ Attachment System The "R0" designation refers to the attachment kit. The **pushPIN™** system is a hardware-based mounting solution that provides: * **Constant Pressure:** A pre-assembled compression spring ensures the heat sink maintains firm contact with the component (e.g., a BGA chip). * **Reliability:** It is more secure than thermal adhesive tapes, especially in high-vibration environments. * **Precision:** Prevents over-tightening or uneven pressure that could damage the silicon die. #### 3. Thermal Interface Material (TIM) The "C2" indicates the thermal interface material provided. In this configuration, it usually comes with **ATS-PPS-02**, a high-performance thermal pad or pre-applied phase-change material designed to bridge the microscopic air gaps between the heat sink base and the electronic chip. --- ### Typical Applications This component is designed for cooling mid-range heat-generating electronics, including: * **Processors/FPGA:** Cooling Field Programmable Gate Arrays or CPUs in industrial PC builds. * **Telecommunications:** Cooling chips in routers, switches, and base stations. * **Power Supplies:** Managing heat in high-efficiency power conversion modules.