The **ATS-P1-178-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling chips and other integrated circuits. ### 1. General Specifications Below are the primary technical characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Product Type** | Heat Sink (Passive Cooling) | | **Attachment Type** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 4.91°C/W (at 100 LFM) | | **Weight** | 35.53 Grams | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and ensuring no interference with surrounding components. | Dimension | Measurement | | :--- | :--- | | **Length** | 35.00 mm | | **Width** | 35.00 mm | | **Height (from base)** | 15.00 mm | | **Pitch (Hole spacing)** | 40.00 mm | --- ### 3. Key Electronic/Thermal Features #### A. Thermal Performance The efficiency of this part is measured by its ability to dissipate heat (Thermal Resistance). As airflow (LFM - Linear Feet per Minute) increases, the resistance drops: * **Unducted Flow:** 4.91°C/W @ 100 LFM. * **Ducted Flow:** 1.50°C/W @ 700 LFM. #### B. The pushPIN™ Mechanism Unlike adhesive-based heat sinks, the "R0" series uses a spring-loaded push-pin system. This provides several electronic/mechanical advantages: 1. **Consistent Pressure:** Ensures the thermal interface material (TIM) is evenly compressed against the chip. 2. **Vibration Resistance:** Securely holds the heat sink in place during transport or industrial vibration. 3. **Pre-applied TIM:** Usually comes with a high-performance thermal interface material pre-applied to the base to improve heat transfer. #### C. Material Science * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Coating:** This is not just for aesthetics; it provides surface protection against corrosion and increases emissivity for better radiative heat transfer. --- ### 4. Typical Applications This specific model is commonly found in: * **Telecommunications:** Cooling routers and switches. * **High-speed Computing:** Cooling FPGAs, ASICs, or specialized microprocessors. * **Power Electronics:** Cooling MOSFET arrays or voltage regulators.