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  • ATS-P1-202-C3-R0

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    The **ATS-P1-202-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**, specifically part of their "push pin" attachment series. This component is designed for cooling electronic devices such as CPUs, GPUs, and high-power integrated circuits. ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Red Anodized | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 20.00mm | | **Attachment Type** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 1.48°C/W (at 200 LFM) | | **Fin Pattern** | straight-fin | --- ### 2. Breakdown of the Model Name The model number follows the standard ATS naming convention, which describes the assembly: * **ATS:** Brand (Advanced Thermal Solutions). * **P1:** Indicates a specific series/profile height. * **202:** Internal size and fin geometry code. * **C3:** Material/Thermal Interface Material (TIM) code. "C3" typically refers to the use of high-performance thermal grease or pad applied to the base. * **R0:** Revision/Finish code (Red Anodized). --- ### 3. Key Features and Applications #### Thermal Management The heat sink utilizes a straight-fin design, which is optimized for **forced-air cooling**. The red anodized finish not only provides aesthetic value but also increases the surface emissivity, slightly improving radiant heat transfer. #### Mechanical Attachment This unit uses a **Push Pin** system with a brass pin and a compression spring. This provides several advantages: * **Consistent Pressure:** Ensures the heat sink maintains firm contact with the electronic component. * **Pre-drilled Holes:** Designed for PCBs with standard hole patterns. * **Durability:** Brass pins offer superior longevity compared to plastic versions. #### Common Use Cases * **Embedded Systems:** For industrial PCs that require reliable cooling. * **Networking Hardware:** Cooling for switches, routers, and FPGA chips. * **Telecommunications:** Used in base stations and high-speed data transmission gear. --- ### 4. Installation Considerations When integrating the ATS-P1-202-C3-R0 into a PCB design, engineers must account for the **Pitch** (distance between mounting holes). Because this uses mechanical push pins, the PCB must have the corresponding holes drilled at the correct distance to match the heat sink base.
    ✨ Follow-up Questions
    • ⤷ What is the exact hole-to-hole pitch required for this heat sink?
    • ⤷ How does the thermal resistance change at different airflow (LFM) levels?
    • ⤷ Does this model come with pre-applied phase change material (PCM)?