ATS-P1-202-C3-R0
AI

The **ATS-P1-202-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**, specifically part of their "push pin" attachment series. This component is designed for cooling electronic devices such as CPUs, GPUs, and high-power integrated circuits.
### 1. Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Red Anodized |
| **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 20.00mm |
| **Attachment Type** | Push Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 1.48°C/W (at 200 LFM) |
| **Fin Pattern** | straight-fin |
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### 2. Breakdown of the Model Name
The model number follows the standard ATS naming convention, which describes the assembly:
* **ATS:** Brand (Advanced Thermal Solutions).
* **P1:** Indicates a specific series/profile height.
* **202:** Internal size and fin geometry code.
* **C3:** Material/Thermal Interface Material (TIM) code. "C3" typically refers to the use of high-performance thermal grease or pad applied to the base.
* **R0:** Revision/Finish code (Red Anodized).
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### 3. Key Features and Applications
#### Thermal Management
The heat sink utilizes a straight-fin design, which is optimized for **forced-air cooling**. The red anodized finish not only provides aesthetic value but also increases the surface emissivity, slightly improving radiant heat transfer.
#### Mechanical Attachment
This unit uses a **Push Pin** system with a brass pin and a compression spring. This provides several advantages:
* **Consistent Pressure:** Ensures the heat sink maintains firm contact with the electronic component.
* **Pre-drilled Holes:** Designed for PCBs with standard hole patterns.
* **Durability:** Brass pins offer superior longevity compared to plastic versions.
#### Common Use Cases
* **Embedded Systems:** For industrial PCs that require reliable cooling.
* **Networking Hardware:** Cooling for switches, routers, and FPGA chips.
* **Telecommunications:** Used in base stations and high-speed data transmission gear.
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### 4. Installation Considerations
When integrating the ATS-P1-202-C3-R0 into a PCB design, engineers must account for the **Pitch** (distance between mounting holes). Because this uses mechanical push pins, the PCB must have the corresponding holes drilled at the correct distance to match the heat sink base.
- ⤷
What is the exact hole-to-hole pitch required for this heat sink?
- ⤷ How does the thermal resistance change at different airflow (LFM) levels?
- ⤷ Does this model come with pre-applied phase change material (PCM)?