The **ATS-P1-49-C3-R0** is a high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it is a heat sink designed for cooling integrated circuits (ICs) and other electronic surface-mount devices. --- ### 1. Technical Specifications Below are the primary mechanical and thermal properties of this specific part number: | Property | Value/Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized Finish) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 26.38°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 25.00mm x 25.00mm | | **Height** | 20.00mm | | **Fin Type** | Straight Fin (Pattern: Fine Pitch) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to define the product's physical characteristics: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **P1**: Specific product series (pushPIN™ standard). * **49**: Specific dimension/geometry code (25mm x 25mm footprint). * **C3**: Thermal Interface Material (TIM) and finish code (typically indicates T412 or similar high-performance TIM and Blue Anodized finish). * **R0**: Revision or packaging code. --- ### 3. Key Electronic Cooling Features * **Push-Pin Attachment:** This part utilizes a spring-loaded push-pin mechanism. This ensures constant pressure on the electronic component (CPU, GPU, or FPGA), which optimizes heat transfer through the Thermal Interface Material. * **Aluminum Construction:** Aluminum provides a high strength-to-weight ratio and excellent thermal conductivity, which is necessary for dissipating heat away from sensitive silicon dies. * **Pre-applied TIM:** The "C3" designation usually implies that a **Thermal Interface Material** is pre-applied to the base, reducing assembly time and ensuring a consistent thermal bond. * **High Fin Density:** The straight-fin design is optimized for environments with forced air (fans), providing a large surface area for heat exchange in a compact 25mm footprint. --- ### 4. Typical Applications This heat sink is commonly found in the following electronic systems: 1. **Telecommunications:** Cooling small processors in routers or switches. 2. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. 3. **Power Electronics:** Managing heat for voltage regulators or small motor drivers.