The **ATS-P1-50-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as CPUs, GPUs, and other high-power ICs. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal properties of this specific model: | Property | Value/Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-P1-50-C3-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Red Anodized | | **Dimensions** | 40mm x 40mm x 15mm | | **Attachment Method** | pushPIN™ (Brass pins / Stainless Steel springs) | | **Thermal Resistance** | 18.99 °C/W (at 200 LFM) | | **Pressure Drop** | 0.28 in. H2O | --- ### 2. Key Electronic & Mechanical Features #### A. Thermal Management Design * **Heat Sink Profile:** It utilizes the **pushPIN™** system, which ensures precise pressure and thermal contact with the electronic component. * **Airflow Efficiency:** The fin geometry is optimized for forced convection (active cooling), but can also function in passive environments depending on the heat load. #### B. Material Composition * **Aluminum 6063:** This alloy is chosen for its high thermal conductivity and structural integrity. * **Red Anodizing:** The coating is not just aesthetic; it provides surface protection against corrosion and slightly improves heat radiation characteristics compared to raw aluminum. #### C. Secure Attachment The **"C3"** in the part number indicates the specific spring and pin configuration: 1. **Uniform Pressure:** Prevents "tilting" of the heat sink, which could damage delicate silicon dies. 2. **Vibration Resistance:** The spring-loaded pins make it ideal for industrial or automotive electronics where movement is expected. --- ### 3. Application Use Cases * **Network Switches:** Cooling high-speed processing chips. * **Embedded Systems:** Used on single-board computers (SBCs) that run under heavy processing loads. * **Power Supplies:** Heat dissipation for MOSFETs or power regulators.