ATS-P1-53-C3-R0
AI

The **ATS-P1-53-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, and FPGAs.
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### 1. Technical Specifications
The following table highlights the critical physical and thermal properties of this part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Black Anodized) |
| **Thermal Resistance** | 0.89 °C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 57.00mm x 61.00mm x 22.86mm |
| **Attachment Method** | pushPIN™ |
| **Fin Style** | Straight (maxiFLOW™) |
| **Thermal Interface Material (TIM)** | T412 |
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### 2. Key Design Features
#### **maxiFLOW™ Geometry**
The "maxiFLOW" design features a flared fin structure. This increases the surface area while reducing pressure drop, allowing for more efficient cooling in systems where airflow is constrained or multidirectional.
#### **pushPIN™ Attachment**
Unlike adhesive-based heat sinks, this model uses a **pushPIN™** mechanism. This offers several advantages:
* **Reliability:** Provides constant pressure for better thermal contact.
* **Durability:** Resists shock and vibration better than tape.
* **Ease of Install:** Uses a pre-assembled brass component and a plastic pin to lock into the PCB.
#### **Thermal Interface Material (TIM)**
The part comes pre-applied with **T412**, a high-performance thermal tape or pad. This ensures that the microscopic air gaps between the electronic component (heat source) and the aluminum base are filled, maximizing heat transfer.
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### 3. Electronic Application
This part is typically used in the following electronic environments:
* **Telecommunications:** Cooling for high-speed routers and switches.
* **Power Electronics:** Dissipating heat from power MOSFETs or IGBTs.
* **Embedded Computing:** Protecting industrial PC processors from thermal throttling.
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### 4. Part Number Breakdown
Understanding the nomenclature helps in identifying variants:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **P1:** Product series.
* **53:** Specific dimension/footprint code.
* **C3:** Material/Finish (typically indicates Black Anodized Aluminum).
* **R0:** Revision or specific packaging code.
- ⤷What is the difference between pushPIN™ and thermal adhesive mounting?
- ⤷ How does 'LFM' airflow affect the thermal resistance of this heat sink?
- ⤷ Is the T412 thermal material replaceable if the heat sink is reused?