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  • ATS-P1-53-C3-R0

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    The **ATS-P1-53-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table highlights the critical physical and thermal properties of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Thermal Resistance** | 0.89 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 57.00mm x 61.00mm x 22.86mm | | **Attachment Method** | pushPIN™ | | **Fin Style** | Straight (maxiFLOW™) | | **Thermal Interface Material (TIM)** | T412 | --- ### 2. Key Design Features #### **maxiFLOW™ Geometry** The "maxiFLOW" design features a flared fin structure. This increases the surface area while reducing pressure drop, allowing for more efficient cooling in systems where airflow is constrained or multidirectional. #### **pushPIN™ Attachment** Unlike adhesive-based heat sinks, this model uses a **pushPIN™** mechanism. This offers several advantages: * **Reliability:** Provides constant pressure for better thermal contact. * **Durability:** Resists shock and vibration better than tape. * **Ease of Install:** Uses a pre-assembled brass component and a plastic pin to lock into the PCB. #### **Thermal Interface Material (TIM)** The part comes pre-applied with **T412**, a high-performance thermal tape or pad. This ensures that the microscopic air gaps between the electronic component (heat source) and the aluminum base are filled, maximizing heat transfer. --- ### 3. Electronic Application This part is typically used in the following electronic environments: * **Telecommunications:** Cooling for high-speed routers and switches. * **Power Electronics:** Dissipating heat from power MOSFETs or IGBTs. * **Embedded Computing:** Protecting industrial PC processors from thermal throttling. --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **P1:** Product series. * **53:** Specific dimension/footprint code. * **C3:** Material/Finish (typically indicates Black Anodized Aluminum). * **R0:** Revision or specific packaging code.
    ✨ Follow-up Questions
    • ⤷What is the difference between pushPIN™ and thermal adhesive mounting?
    • ⤷ How does 'LFM' airflow affect the thermal resistance of this heat sink?
    • ⤷ Is the T412 thermal material replaceable if the heat sink is reused?