The **ATS-P1-55-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as CPUs, GPUs, and high-power chipsets. Below is a detailed breakdown of its specifications and design features. ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Body) | | **Thermal Resistance** | 23.98°C/W (Unducted Flow @ 100 LFM) | | **Fin Type** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic) | | **Surface Finish** | Blue Anodized | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Physical Dimensions Detailed geometry is critical for ensuring the part fits on a Printed Circuit Board (PCB) without interfering with other components. * **Length x Width:** 35.00mm x 35.00mm * **Height:** 10.00mm * **Pitch (Hole to Hole):** 40.00mm (Square) --- ### 3. Electronic Design Components This part is not just a block of metal; it is an engineered thermal management assembly consisting of three main sub-parts: #### A. The Heat Sink Body The body is made of extruded aluminum. The **straight fin** design is optimized for environments where airflow is unidirectional. The blue anodized coating is not just for aesthetics; it provides corrosion resistance and slightly improves radiative heat transfer. #### B. The pushPIN™ Attachment System Instead of using messy adhesives or complicated screws, this model uses a plastic push-pin system. * **Hardware:** Plastic pins with compression springs. * **Benefit:** Provides consistent pressure (clamping force) across the component to ensure maximum contact with the thermal interface. #### C. Thermal Interface Material (TIM) The base comes pre-applied with **T412**. This is a phase-change or high-performance pad that fills microscopic air gaps between the electronic chip and the heat sink base, significantly reducing thermal impedance. --- ### 4. Application Context This specific model is often used in: * **Telecommunications:** Cooling signal processors. * **Embedded Systems:** High-density PCBs where vertical space (10mm height) is limited. * **Industrial PCs:** Where vibration resistance is necessary (provided by the spring-loaded pins). ---