The **ATS-P1-58-C3-R0** is a high-performance electronic thermal management component, specifically an aluminum heat sink designed for cooling integrated circuits (ICs) and other electronic components. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-P1-58-C3-R0 | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 0.82°C/W (at 200 LFM) | --- ### Key Electronic & Mechanical Features #### 1. Thermal Dissipation The primary role of this part is to conduct heat away from a semiconductor (such as a CPU, GPU, or FPGA) and dissipate it into the surrounding air. With a height of 25mm, it provides a large surface area for heat exchange, which is critical for maintaining component longevity and preventing thermal throttling. #### 2. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a **pushPIN™** system. This provides several advantages: * **Constant Pressure:** Ensures optimal contact between the heat sink and the component surface. * **Secure Mounting:** Resistant to shocks and vibrations, making it suitable for industrial or automotive electronics. * **Ease of Maintenance:** Can be removed and re-installed without damaging the PCB or leaving adhesive residue. #### 3. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization layer provides corrosion resistance and improves thermal emissivity (the ability to radiate heat). #### 4. Compatibility (C3-R0 Designation) * **C3:** Refers to the specific spring and pin configuration used for mounting. * **R0:** Indicates the specific version/revision of the product according to ATS standards. --- ### Typical Applications * **Networking Hardware:** Routers, switches, and server components. * **Power Electronics:** Voltage regulators and power transistors. * **Embedded Systems:** Industrial PCs and automation controllers that generate significant heat in a small footprint.