### ATS-P1-63-C1-R0 Technical Specifications The **ATS-P1-63-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **maxiFLOW™** series, designed specifically for high-velocity airflow environments to cool electronic components such as processors, FPGAs, and ASICs. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 12.29°C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | Straight (maxiFLOW™) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Physical Design and Structure The electronic and thermal performance of this part is driven by its physical architecture: * **maxiFLOW™ Design:** The fin structure features a tapered profile that increases the surface area while minimizing pressure drop. This allows more air to flow through the heat sink rather than around it. * **Aluminum Construction:** Chosen for its excellent thermal conductivity-to-weight ratio. The **Blue Anodized** finish provides surface protection and slightly improves radiation heat transfer. * **pushPIN™ Attachment:** This system includes a pre-assembled brass component and a stainless steel spring. This ensures a precise "TIM" (Thermal Interface Material) compression for optimal heat transfer from the electronic component to the heat sink. --- ### 3. Thermal Performance Profile The effectiveness of the ATS-P1-63-C1-R0 depends on the airflow velocity (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 12.29 | | 300 (1.5 m/s) | 4.22 | | 500 (2.5 m/s) | 2.50 | | 700 (3.5 m/s) | 1.83 | --- ### 4. Hardware Components The assembly consists of the following mechanical-electronic integration parts: 1. **Heat Sink:** The primary thermal dissipator. 2. **Springs:** Provides a consistent 27-gauge pressure to ensure the base stays in contact with the chip. 3. **Push Pins:** Nylon or plastic pins that secure the unit to the PCB through pre-drilled holes.