The **ATS-P1-67-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to optimize airflow and heat dissipation for high-power electronic devices. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Extruded) | | **Finish** | Blue Anodized | | **Mounting Style** | pushPIN™ (Fastener system) | | **Thermal Resistance** | 20.35°C/W (Natural Convection) | | **Attachment Type** | Spring-loaded push pins | | **Interface Material** | T412 (Thermal Interface Material) | ### 2. Physical Dimensions Precision is critical for PCB layout and clearance. The dimensions for the **67-C3** variant are as follows: * **Length (A):** 45.00 mm * **Width (B):** 45.00 mm * **Height (C):** 10.00 mm * **Pitch (E/F):** 38.00 mm (Distance between mounting holes) ### 3. Key Design Features The **ATS-P1-67-C3-R0** incorporates several engineering choices that enhance its efficiency: * **maxiFLOW™ Fin Geometry:** The fins are designed with a tapered profile that increases surface area and creates turbulence, which significantly improves the heat transfer coefficient compared to standard straight-fin heat sinks. * **pushPIN™ Attachment:** This system uses a flexible, spring-loaded mechanism that ensures consistent pressure between the heat sink and the component (e.g., a CPU, FPGA, or GPU), optimizing the thermal interface. * **Pre-applied TIM:** It comes with **T412** thermal interface material pre-applied to the base, which eliminates the need for manual thermal paste application and ensures a reliable bond. * **Blue Anodized Coating:** Beyond aesthetics, the anodization protects the aluminum from corrosion and slightly improves radiant heat emission. ### 4. Typical Applications This part is commonly used in environments where space is limited but heat density is high: 1. **Telecommunications:** Cooling high-speed switching components. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Cooling MOSFETs and power modules in compact enclosures. ---