ATS-P1-73-C3-R0
AI

The **ATS-P1-73-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-P1-73-C3-R0 |
| **Base Material** | Aluminum |
| **Finish** | Red Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Dimensions** | 25mm x 25mm x 30mm |
| **Thermal Resistance** | 3.32°C/W (at 200 LFM) |
| **Pattern Type** | Straight Fin |
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### 2. Physical Design and Features
* **Straight Fin Geometry:** This model uses a vertical straight fin design, which is optimized for **forced-air cooling** (airflow from fans). The gaps between the fins allow air to pass through and carry heat away from the base.
* **Thermal Interface Material (TIM):** The "-R0" suffix typically indicates that the part comes pre-applied with **T766 Chomerics phase-change material**, which improves heat transfer between the electronic chip and the heat sink.
* **Push-Pin Attachment:** It uses a spring-loaded push-pin mechanism. This provides a specific amount of downward pressure (clamping force) to ensure consistent thermal contact while making installation fast and tool-less.
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### 3. Material and Finish
The heat sink is made of **Aluminum 6063**. The **Red Anodized** finish is not just for aesthetics; it provides:
1. **Corrosion Resistance:** Protects the aluminum from oxidation.
2. **Electrical Insulation:** The anodized layer is non-conductive.
3. **Improved Emissivity:** Enhances the heat radiation properties slightly compared to raw aluminum.
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### 4. Thermal Performance
The performance of this heat sink depends heavily on the airflow (Measured in Linear Feet per Minute - LFM):
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **200 (1.0 m/s)** | 3.32 |
| **400 (2.0 m/s)** | 2.48 |
| **600 (3.0 m/s)** | 2.12 |
*Lower Thermal Resistance is better, as it indicates the sink can dissipate heat more efficiently.*
- ⤷
What are the specific hole patterns required for the push-pin installation of this heat sink?
- ⤷ Can this heat sink be used for passive cooling without a fan?
- ⤷ What are the alternatives to push-pin mounting for this specific size?