Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-P1-74-C3-R0

  • AI
    The **ATS-P1-74-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**. It is designed by Advanced Thermal Solutions (ATS) as part of their "push-pin" attachment series. --- ### 1. Technical Specifications The part number encodes specific characteristics of the heat sink's physical and thermal properties: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.13°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 35.00mm | | **Mounting Style** | Push-Pin (Plastic or Brass) | | **Thermal Interface Material** | T412 (Double-sided thermal tape) | --- ### 2. Physical Design and Structure * **Fin Profile:** This model uses a **straight fin** design. Straight fins are highly efficient in forced-air environments where the airflow direction is consistent. * **Aspect Ratio:** With a height of 35mm on a 25mm base, it is considered a "tall" heat sink, providing a large surface area for heat dissipation in space-constrained layouts. * **Material Choice:** Aluminum 6063 is used for its excellent thermal conductivity and structural integrity, while the blue anodization prevents corrosion and increases emissivity. --- ### 3. Electronic Application & Usage This part is typically used to cool discrete electronic components that generate significant heat during operation. * **Target Components:** * FPGAs (Field Programmable Gate Arrays) * ASICs (Application-Specific Integrated Circuits) * Power Transistors (MOSFETs) * High-speed microprocessors * **Mounting Mechanism:** The "Push-Pin" system uses a spring-loaded mechanism that ensures constant pressure (clamping force) between the heat sink and the electronic component. This improves thermal transfer and makes assembly faster compared to screw-down methods. --- ### 4. Thermal Performance Data Performance varies based on the velocity of the air moving through the fins (Measured in Linear Feet per Minute - LFM): | Air Velocity | 100 LFM | 300 LFM | 500 LFM | 700 LFM | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 2.13 | 1.15 | 0.92 | 0.81 | ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between T412 and other Thermal Interface Materials used in this series?
    • ⤷ How do I calculate the correct hole diameter on the PCB for the push-pin mounting?
    • ⤷ Can this heat sink be used in natural convection environments without a fan?