ATS-P1-74-C3-R0
AI

The **ATS-P1-74-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**. It is designed by Advanced Thermal Solutions (ATS) as part of their "push-pin" attachment series.
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### 1. Technical Specifications
The part number encodes specific characteristics of the heat sink's physical and thermal properties:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 2.13°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 35.00mm |
| **Mounting Style** | Push-Pin (Plastic or Brass) |
| **Thermal Interface Material** | T412 (Double-sided thermal tape) |
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### 2. Physical Design and Structure
* **Fin Profile:** This model uses a **straight fin** design. Straight fins are highly efficient in forced-air environments where the airflow direction is consistent.
* **Aspect Ratio:** With a height of 35mm on a 25mm base, it is considered a "tall" heat sink, providing a large surface area for heat dissipation in space-constrained layouts.
* **Material Choice:** Aluminum 6063 is used for its excellent thermal conductivity and structural integrity, while the blue anodization prevents corrosion and increases emissivity.
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### 3. Electronic Application & Usage
This part is typically used to cool discrete electronic components that generate significant heat during operation.
* **Target Components:**
* FPGAs (Field Programmable Gate Arrays)
* ASICs (Application-Specific Integrated Circuits)
* Power Transistors (MOSFETs)
* High-speed microprocessors
* **Mounting Mechanism:** The "Push-Pin" system uses a spring-loaded mechanism that ensures constant pressure (clamping force) between the heat sink and the electronic component. This improves thermal transfer and makes assembly faster compared to screw-down methods.
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### 4. Thermal Performance Data
Performance varies based on the velocity of the air moving through the fins (Measured in Linear Feet per Minute - LFM):
| Air Velocity | 100 LFM | 300 LFM | 500 LFM | 700 LFM |
| :--- | :--- | :--- | :--- | :--- |
| **Thermal Resistance (°C/W)** | 2.13 | 1.15 | 0.92 | 0.81 |
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- ⤷
What is the difference between T412 and other Thermal Interface Materials used in this series?
- ⤷ How do I calculate the correct hole diameter on the PCB for the push-pin mounting?
- ⤷ Can this heat sink be used in natural convection environments without a fan?