The **ATS-P1-85-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, and other high-heat-generating integrated circuits. --- ### 1. Key Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Heat Sink Type** | Straight Fin (Extruded) | | **Material** | Aluminum (AL-6063-T5) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 10.0mm | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Component Analysis #### A. The Fin Geometry (Straight Fin) This heat sink uses a **straight fin** design. Straight fins provide an efficient cooling path for airflow that is moving in a single direction (unidirectional). The 10mm height makes it a "low-profile" solution, ideal for compact server racks or thin electronic enclosures where vertical space is limited. #### B. Attachment: Push Pin & Spring Unlike adhesive-based heat sinks, the `-R0` series uses a mechanical **Push Pin and Spring** mechanism. * **Benefits:** It provides consistent pressure on the component (IC), ensuring optimal contact with the Thermal Interface Material (TIM). * **Security:** It is more vibration-resistant than tape and allows for easier removal or rework. #### C. Thermal Performance The efficiency of this part is measured by its **Thermal Resistance** (°C/W). Lower values indicate better cooling performance. | Airflow Rate (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | ~23.0 | | 300 (1.5 m/s) | ~8.0 | | 500 (2.5 m/s) | ~5.8 | --- ### 3. Part Number Breakdown * **ATS:** Manufacturer prefix. * **P1:** Part of the pushPIN™ series. * **85:** Specific model identifier (defines dimensions). * **C1:** Material and Color code (Aluminum, Blue Anodized). * **R0:** Packaging or Revision indicator. --- ### 4. Applications * **Embedded Systems:** Cooling SoCs (System on Chips). * **Telecommunications:** High-speed network switches and routers. * **Power Electronics:** Cooling MOSFETs or voltage regulators. * **Industrial PC:** Low-profile cooling for ruggedized computers.