The **ATS-P1-86-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the *maxiFLOW™* series, designed for high-efficiency cooling in constrained spaces. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Below are the primary specifications for this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Typical)** | 3.10°C/W (at 200 LFM) | | **Dimensions (L x W)** | 35.00 mm x 35.00 mm | | **Height (Fin height)** | 15.00 mm | | **Thermal Interface Material (TIM)** | T412 (Double-sided thermal tape/film) | --- ### 2. Key Design Elements #### A. maxiFLOW™ Fin Geometry The fin structure is designed to maximize surface area while minimizing pressure drop. Unlike standard straight-fin heat sinks, these feature a tapered fin design that increases airflow through the fin field, which is critical for densely packed electronic PCBs. #### B. pushPIN™ Attachment System This part utilizes the **pushPIN™** mounting mechanism. This is advantageous because: * It provides consistent pressure for the Thermal Interface Material (TIM). * The pre-assembled springs ensure the heat sink remains secure under mechanical shock or vibration. * It simplifies the assembly process on the production line. #### C. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** Besides aesthetics, the anodization protects the aluminum from corrosion and slightly improves radiant heat transfer. --- ### 3. Applications The ATS-P1-86-C3-R0 is typically used to cool high-heat-generating surface-mount components, such as: * **Processors (CPUs/GPUs):** Low-power or mobile variants. * **FPGAs & ASICs:** Integrated circuits used in networking or industrial automation. * **Power Supplies:** Regulators and power transistors that require active or passive air cooling. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 7.00 | | 300 (1.5 m/s) | 2.50 | | 500 (2.5 m/s) | 1.80 |