The **ATS-P1-87-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the "pushPIN™" series manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its specifications, construction, and electronic application. --- ## 1. Technical Specifications This component is designed for precise cooling of electronic components like CPUs, GPUs, or high-power MOSFETs. | Specification | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance (Flowing)** | 2.77 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 7.00 °C/W (Duct) | | **Dimensions (L x W)** | 35.00mm x 35.00mm | | **Height (H)** | 25.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | --- ## 2. Key Electronic Components & Features ### A. The Fin Design (Straight Fin) The "P1" designation indicates a **Straight Fin** geometry. * **Purpose:** This design provides a large surface area for heat dissipation while maintaining a low pressure drop. * **Function:** It is optimized for systems with consistent directional airflow (forced convection). ### B. Thermal Interface Material (TIM) * **Part Suffix C3:** This indicates that the heat sink comes pre-applied with **T766** thermal phase change material. * **Function:** This fills the microscopic air gaps between the electronic chip (heat source) and the aluminum base to maximize heat transfer. ### C. Attachment Mechanism (pushPIN™) The "R0" at the end of the part number refers to the mounting hardware. * **Hardware:** It uses a brass or plastic push-pin with a stainless steel spring. * **Reliability:** The spring provides a specific, consistent "clamping force" on the electronic package, which prevents damage to the silicon die while ensuring optimal thermal contact. --- ## 3. Physical Dimensions The precise geometry is critical for PCB layout and avoiding interference with other electronic parts like capacitors. | Dimension | Value (mm) | | :--- | :--- | | **Length (A)** | 35.0 mm | | **Width (B)** | 35.0 mm | | **Height (C)** | 25.0 mm | | **Pitch (E)** | 40.0 mm (Hole to Hole) | | **Pitch (F)** | 40.0 mm (Hole to Hole) | --- ## 4. Application in Circuitry The **ATS-P1-87-C3-R0** is typically found in: 1. **Telecommunications:** Cooling high-speed processors in switches and routers. 2. **Embedded Systems:** Industrial PCs where high-reliability mounting is required. 3. **Power Electronics:** Dissipating heat from voltage regulators or power modules.