The **ATS-P1-92-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" line of thermal management products, designed for cooling electronic components such as CPUs, GPUs, and power semiconductors. ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 16.58 °C/W (at 100 LFM) | | **Fin Pattern** | Straight Fin | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Design Components The ATS-P1-92-C3-R0 consists of four major electronic/mechanical sub-components: #### A. The Heat Sink Body Constructed from aluminum, the body uses a straight-fin design. This is optimized for **forced air cooling** (fans), allowing air to flow through the channels to dissipate heat from the baseplate. #### B. pushPIN™ Attachment Unlike adhesive tapes or simple clips, the pushPIN™ system provides a secure, mechanical connection to the PCB. This ensures consistent pressure between the heat sink and the component, which is vital for thermal efficiency. #### C. Compression Spring The "R0" in the part number indicates a specific spring tension. The spring ensures the heat sink remains in contact with the electronic chip even during mechanical shock or vibration, maintaining the **Thermal Interface Material (TIM)** integrity. #### D. Thermal Interface Material (TIM) This model typically comes pre-applied with a high-performance thermal pad or grease. The TIM fills microscopic air gaps between the component surface and the heat sink base to maximize heat transfer. --- ### 3. Thermal Performance Profile Thermal resistance varies based on the airflow velocity (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 16.58 | | 200 (1.0 m/s) | 6.27 | | 400 (2.0 m/s) | 3.33 | | 600 (3.0 m/s) | 2.50 | --- ### 4. Typical Applications * **Embedded Systems:** Cooling microprocessors on industrial motherboards. * **Telecommunications:** Dissipating heat from high-speed data chips. * **Power Supplies:** Managing heat for voltage regulators and MOSFETs.