The **ATS-P1-97-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as CPUs, GPUs, and high-power chipsets. Below is a detailed breakdown of its specifications and design features. --- ### 1. Technical Specifications The part belongs to the **pushPIN™** series, known for its secure and standardized attachment mechanism. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 20.39 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Thermal Interface Material (TIM)** | T412 (High-performance pre-applied pad) | --- ### 2. Key Component Features #### A. Fin Design The "97" in the part number refers to the **Straight Fin** geometry. This design allows for: * Low pressure drop across the heat sink. * Efficient cooling in environments where airflow is directed by a fan or system shroud. #### B. Attachment Mechanism (pushPIN™) Unlike adhesive tapes that can fail over time, this part uses a mechanical spring-loaded pin system. * **Springs:** Ensure constant pressure (COF) on the component for maximum heat transfer. * **Pins:** Designed for pre-drilled holes in the PCB, providing a vibration-resistant mount. #### C. Thermal Performance The performance varies based on the airflow (LFM - Linear Feet per Minute): | Airflow Velocity | 100 LFM | 300 LFM | 500 LFM | | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 20.39 | 5.48 | 3.35 | --- ### 3. Part Number Breakdown (Nomenclature) To understand variations of this part, here is how the SKU is structured: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **P1**: Attachment Type (pushPIN™). * **97**: Fin profile/style. * **C3**: Material and Finish code (Aluminum, Blue Anodized). * **R0**: Revision/Packaging code. --- ### 4. Implementation Requirements To use this part on a PCB, you must ensure: 1. **Hole Pattern:** The PCB must have two mounting holes spaced to match the heat sink footprint. 2. **Z-Height:** The 10mm height is "low-profile," making it suitable for 1U server chassis or compact embedded systems.