The **ATS-P2-04-C1-R0** is a high-performance **heat sink** assembly manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed specifically for thermal management in electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Pitch (Pattern)** | Square (approx. 33mm) | | **Thermal Resistance** | ~11.5°C/W (Unducted Flow) | | **Spring Type** | Stainless Steel (R0 suffix) | --- ### 2. Design Components The assembly consists of four primary electronic/mechanical parts: 1. **The Heat Sink (Extrusion):** * Features a **straight-fin** design. * Made from 6063 aluminum for high thermal conductivity. * The 20mm height (the "04" in the part number) provides a balance between surface area for heat dissipation and low-profile clearance. 2. **Push-Pins:** * The "P2" designation refers to the specific push-pin hardware. * These are usually made of brass or plastic, designed to snap into pre-drilled holes (3mm) on the Printed Circuit Board (PCB). 3. **Compression Springs:** * Provide consistent "Normal Force" to ensure the heat sink remains in tight contact with the chip. * The "R0" indicates a specific spring tension and material (usually stainless steel). 4. **Thermal Interface Material (TIM):** * The "C1" indicates that the part comes pre-applied with **Phase Change Material** (or high-performance grease). * This fills microscopic air gaps between the component and the heat sink. --- ### 3. Key Features for Electronics Design * **Thermal Performance:** Engineered to optimize airflow in "ducted" or "unducted" environments (meaning with or without a fan blowing directly on it). * **Mechanical Reliability:** The push-pin system prevents the heat sink from shifting during vibration or shipping, which is critical for industrial or server electronics. * **Compatibility:** Designed for standard hole patterns commonly found on PCBs for mid-range processors.