The **ATS-P2-111-C3-R1** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components such as CPUs, GPUs, and high-power ICs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Property | Value / Specification | | :--- | :--- | | **Material** | Aluminum (High Thermal Performance) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 30.00mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | ~2.72°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T412 (Double-sided thermal tape/pad) | --- ### 2. Key Features * **Heat Sink Profile:** It features a **Straight Fin** design, which is optimal for systems with consistent directional airflow. * **Push-Pin Mounting:** This mechanism uses a pre-drilled hole on the PCB to secure the heat sink. It provides high pressure to ensure the Thermal Interface Material (TIM) works effectively without shifting. * **C3 Classification:** This usually refers to the specific hardware kit (spring type and pin material) used to provide a specific amount of force on the chip. * **T412 TIM:** The "R1" suffix typically indicates it comes with a pre-applied high-performance thermal pad, reducing assembly time. --- ### 3. Application Use-Cases This specific electronic part is commonly used in: 1. **Network Switches/Routers:** Cooling processors that handle high data throughput. 2. **Embedded Systems:** For industrial PCs where vibration resistance is necessary (push-pins are more secure than adhesive alone). 3. **Power Supplies:** Managing heat in MOSFETs or voltage regulators. --- ### 4. Thermal Performance Data *Approximate values based on airflow velocity:* | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 2.72 | | 400 | 2.0 | 1.61 | | 600 | 3.0 | 1.35 | ---