The **ATS-P2-112-C1-R1** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for cooling processors and other high-heat surface-mount components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 2.60°C/W (at 200 LFM) | | **Dimensions** | 35mm x 35mm x 35mm | | **Fin Style** | Straight Fin (Square) | | **Interface Material** | T766 (Thermal Tape/Grease equivalent) | --- ### 2. Key Features * **High Aspect Ratio Fins:** The vertical fins are designed to maximize surface area for heat dissipation without significantly increasing the footprint on the PCB. * **Push-Pin Attachment:** It uses a spring-loaded push-pin mechanism. This provides a specific, consistent pressure for maximum thermal transfer and ensures the heat sink remains secure during mechanical shock or vibration. * **Pre-Applied Thermal Interface Material (TIM):** The "R1" suffix typically indicates that the part comes with a pre-applied thermal material, reducing assembly time and ensuring a reliable bond between the component and the heat sink. * **Universal Compatibility:** The 35mm footprint is a standard size for many BGA (Ball Grid Array) and FPGA chips. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how efficiently the part moves heat away from the component. Lower numbers are better. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 m/s (200 LFM) | 2.60 | | 1.5 m/s (300 LFM) | 2.10 | | 2.0 m/s (400 LFM) | 1.80 | --- ### 4. Application Use Cases This specific heat sink is commonly found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Supplies:** Cooling MOSFETs or power ICs. 4. **Consumer Electronics:** High-end networking gear.