The **ATS-P2-112-C3-R1** is a high-performance electronic component specifically designed for thermal management. It is a **heat sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its electronic and physical specifications. --- ### 1. Technical Specifications This part belongs to the **maxiFLOW™** series, which is known for its high-efficiency fin geometry designed to maximize surface area and improve cooling performance. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-P2-112-C3-R1 | | **Heat Sink Type** | maxiFLOW™ | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 0.66 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 40.00mm x 12.70mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. Fin Design (maxiFLOW™) The "maxiFLOW" design uses a **tapered fin** structure. This reduces pressure drop while increasing the cooling surface area, allowing it to perform efficiently in both low-airflow and high-airflow environments. #### B. pushPIN™ Mounting System The `-R1` suffix indicates a specific mounting kit. The pushPIN™ system allows for: * **Uniform Pressure:** Ensures consistent contact between the electronic component (CPU, FPGA, GPU) and the heat sink. * **Secure Attachment:** Uses a compression spring and plastic/brass pins to lock into pre-drilled holes on the PCB. * **Ease of Installation:** No specialized tools are required for high-volume assembly. #### C. Thermal Interface Material (T766) The part comes with **T766** pre-applied. This is a phase-change or high-performance thermal grease that fills microscopic air gaps between the chip surface and the heat sink base, significantly improving heat transfer efficiency. --- ### 3. Application Use-Cases This heat sink is typically found in high-reliability electronic systems where space is limited but heat dissipation is critical: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Industrial Controls:** Power management modules and microcontrollers. 3. **Embedded Computing:** Cooling high-performance processors in compact enclosures. 4. **Medical Electronics:** Used in diagnostic equipment where silent (fanless or low-fan) cooling is preferred. ---