The **ATS-P2-113-C1-R0** is a specific high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it belongs to the **pushPIN™** Heat Sink Assembly series. --- ## 1. Technical Specifications This part is a heat sink designed for cooling surface-mount components such as CPUs, GPUs, or FPGAs. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | ATS-HK91-R0 | | **Thermal Interface Material (TIM)** | NO TIM (None) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 15.00mm | --- ## 2. Design and Component Breakdown ### A. Fin Configuration The "P2" designation refers to the fin pattern. This model typically features a **Straight Fin** or **Cross-Cut** design which allows for multi-directional airflow. The low profile (15mm height) is ideal for space-constrained enclosures. ### B. The pushPIN™ Attachment System Unlike adhesive tapes or simple clips, the pushPIN system consists of: * **Plastic Push-Pins:** These provide a secure, vibration-resistant mechanical connection to the PCB. * **Compression Springs:** These apply a precise amount of downward pressure (clamping force) on the electronic component to ensure maximum thermal contact. ### C. Thermal Performance The thermal resistance of this unit is highly dependent on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | ~15.79 (Unducted) | | 300 (1.5 m/s) | ~5.26 (Unducted) | | 500 (2.5 m/s) | ~3.60 (Unducted) | --- ## 3. Part Number Decoder To understand variations of this part, here is how the nomenclature is structured: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **P2:** Fin design/pitch code. * **113:** Specific dimension and profile code. * **C1:** Material/Finish code (C1 usually denotes Aluminum/Blue Anodized). * **R0:** Revision or packaging code. --- ## 4. Key Application Notes 1. **Hole Pattern:** This heat sink requires specific pre-drilled holes in the PCB to accommodate the push-pins. 2. **TIM Selection:** Since this specific model ("R0") does not come with pre-applied Thermal Interface Material, a high-quality thermal paste or pad must be applied manually to the component surface before installation. 3. **Flow Direction:** The straight fin design is optimized for environments with a clear intake-to-exhaust airflow path.