ATS-P2-114-C3-R0
AI

The **ATS-P2-114-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for cooling high-power semiconductors and integrated circuits.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part number:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (Blue Anodized) |
| **Base Dimensions** | 40mm x 40mm |
| **Height** | 12.7mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 7.50°C/W (at 100 LFM) |
| **Thermal Interface Material** | T412 (Phase change or tape) |
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### 2. Design and Engineering Features
* **maxiFLOW™ Geometry:** The heat sink features a unique "flared fin" design. This geometry maximizes the surface area for heat dissipation while maintaining a low pressure drop, making it highly efficient in forced-air environments (fans).
* **pushPIN™ Attachment:** The "-R0" designation indicates it uses the pushPIN™ mounting system. This provides a secure, vibration-resistant connection to the PCB using a brass pin and a stainless steel spring to ensure consistent pressure.
* **Blue Anodized Finish:** The surface treatment is not just aesthetic; it increases the emissivity of the aluminum, slightly improving radiation heat transfer and protecting the metal from environmental corrosion.
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### 3. Electronic Application
This part is typically used for cooling the following electronic components:
1. **BGA Packages:** Ball Grid Array processors or chipsets.
2. **FPGAs/ASICs:** Field Programmable Gate Arrays that generate significant heat during high-speed data processing.
3. **Power Converters:** High-density DC-DC converters that require compact thermal solutions.
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### 4. Part Number Breakdown
Understanding the SKU helps in selecting the right variant:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **P2** | pushPIN™ Series |
| **114** | Physical Profile/Series Identifier |
| **C3** | Thermal Interface Material (TIM) code |
| **R0** | Revision/Packaging code |
- ⤷What is the difference between pushPIN and adhesive mounting for this heat sink?
- ⤷ How does the LFM (Linear Feet per Minute) affect the thermal resistance of this part?
- ⤷ Can this heat sink be used for passive cooling without a fan?