Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-P2-114-C3-R0

  • AI
    The **ATS-P2-114-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed for cooling high-power semiconductors and integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Base Dimensions** | 40mm x 40mm | | **Height** | 12.7mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 7.50°C/W (at 100 LFM) | | **Thermal Interface Material** | T412 (Phase change or tape) | --- ### 2. Design and Engineering Features * **maxiFLOW™ Geometry:** The heat sink features a unique "flared fin" design. This geometry maximizes the surface area for heat dissipation while maintaining a low pressure drop, making it highly efficient in forced-air environments (fans). * **pushPIN™ Attachment:** The "-R0" designation indicates it uses the pushPIN™ mounting system. This provides a secure, vibration-resistant connection to the PCB using a brass pin and a stainless steel spring to ensure consistent pressure. * **Blue Anodized Finish:** The surface treatment is not just aesthetic; it increases the emissivity of the aluminum, slightly improving radiation heat transfer and protecting the metal from environmental corrosion. --- ### 3. Electronic Application This part is typically used for cooling the following electronic components: 1. **BGA Packages:** Ball Grid Array processors or chipsets. 2. **FPGAs/ASICs:** Field Programmable Gate Arrays that generate significant heat during high-speed data processing. 3. **Power Converters:** High-density DC-DC converters that require compact thermal solutions. --- ### 4. Part Number Breakdown Understanding the SKU helps in selecting the right variant: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **P2** | pushPIN™ Series | | **114** | Physical Profile/Series Identifier | | **C3** | Thermal Interface Material (TIM) code | | **R0** | Revision/Packaging code |
    ✨ Follow-up Questions
    • ⤷What is the difference between pushPIN and adhesive mounting for this heat sink?
    • ⤷ How does the LFM (Linear Feet per Minute) affect the thermal resistance of this part?
    • ⤷ Can this heat sink be used for passive cooling without a fan?