The **ATS-P2-118-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | Part of the *maxiFLOW™* series | | **Material** | Aluminum | Blue Anodized finish | | **Dimensions** | 45mm x 45mm x 10mm | (L x W x H) | | **Fin Style** | Straight Fin | Optimized for high-velocity airflow | | **Attachment Method** | pushPIN™ | Uses plastic pins and springs for mounting | | **Thermal Resistance** | ~6.52°C/W (Unducted) | Varies based on airflow (LFM) | --- ### 2. Electronic/Physical Components While the heat sink itself is passive (no moving parts), it incorporates several design elements to interact with electronic systems: * **Thermal Interface Material (TIM):** This part usually comes with **T766** pre-applied. TIM is critical in electronics to fill microscopic air gaps between the heat sink and the semiconductor to improve heat transfer. * **pushPIN™ Attachment:** Instead of messy adhesives, it uses a mechanical spring-loaded pin system. This provides precise pressure (7-10 lbs) on the electronic chip, ensuring optimal thermal contact without cracking the silicon die. * **maxiFLOW™ Geometry:** The fin structure is flared. In electronic enclosures with high component density, this design reduces pressure drop and increases the surface area for radiant and convective cooling. --- ### 3. Application Use Cases This specific part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling of ASICs and FPGAs in network switches. 2. **Embedded Systems:** Industrial PCs where vertical space (10mm height) is limited. 3. **Power Electronics:** Dissipating heat from high-current voltage regulators. --- ### 4. Airflow Performance Data Electronic engineers use the following data to determine if this part fits their thermal budget: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 6.52 | | 400 (2.0 m/s) | 3.13 | | 600 (3.0 m/s) | 2.30 | ---