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The **ATS-P2-122-C1-R0** is a high-performance electronic cooling component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, and FPGAs.
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### 1. Technical Specifications
The part number encodes specific physical and thermal characteristics:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (with Blue Anodized Finish) |
| **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 15.00mm |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | 5.84°C/W @ 200 LFM (Airflow) |
| **Fin Style** | T-Cut (Optimizes airflow across the surface) |
| **RoHS Status** | Compliant (Lead-free) |
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### 2. Key Electronic Functions
While the heat sink itself does not carry current, it is a critical "passive" electronic part for the following reasons:
* **Thermal Management:** It prevents "Thermal Throttling" of high-speed processors by conducting heat away from the silicon die.
* **Reliability Enhancement:** By maintaining lower operating temperatures, it extends the Mean Time Between Failures (MTBF) of the electronic assembly.
* **EMI Shielding (Secondary):** In some configurations, grounded metal heat sinks can provide minor electromagnetic interference (EMI) suppression for the chip they cover.
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### 3. Component Breakdown
#### **A. The Fin Design (maxiFLOW™)**
The "T-cut" fin geometry is engineered to reduce pressure drop. In electronics, this means the cooling fan doesn't have to work as hard (lower power consumption) to push air through the sink.
#### **B. The Attachment (pushPIN™)**
The `P2` in the part number indicates a specific pushPIN™ attachment. This uses a brass or plastic pin with a compressed spring. It ensures:
1. **Consistent Pressure:** Even contact across the thermal interface material (TIM).
2. **Vibration Resistance:** Secure mounting for industrial or automotive electronics.
#### **C. Blue Anodized Coating**
The `C1` suffix indicates the finish. Anodizing is not just for aesthetics; it provides electrical insulation (to prevent shorts if a wire touches the sink) and increases surface emissivity, aiding in radiant heat transfer.
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### 4. Comparison with Standard Sinks
Compared to generic extruded heat sinks, the ATS-P2-122-C1-R0 offers:
* **Higher Surface Area:** More fins in a smaller 50x50mm footprint.
* **Lower Profile:** At 15mm height, it fits in 1U server chassis or slim electronic enclosures.
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What are the compatible thermal interface materials (TIM) for this heat sink?
- ⤷ How do I calculate the required airflow (LFM) for my specific processor?
- ⤷ What is the difference between the C1 and C2 finish codes in ATS parts?