The **ATS-P2-133-C1-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS)** heat sink from the *maxiFLOW™* series. --- ### 1. Technical Specifications This part is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 70mm x 70mm x 10mm | | **Thermal Resistance (Flowing Air)** | 1.15°C/W @ 200 LFM | | **Thermal Resistance (Static Air)** | 2.10°C/W | --- ### 2. Key Electronic Features #### A. maxiFLOW™ Design The heat sink features a tapered fin design that maximizes the surface area for radiant cooling while minimizing pressure drop. This is critical for dense electronic enclosures where airflow might be restricted. #### B. pushPIN™ Attachment Unlike adhesive-based heat sinks, the **R0** suffix indicates a mechanical attachment system. * **Hardware:** It uses a brass or plastic push-pin with a stainless steel spring. * **Benefits:** It provides consistent pressure (7-10 PSI) across the electronic chip, ensuring optimal contact with the Thermal Interface Material (TIM). #### C. Thermal Interface Material (TIM) The part comes pre-applied with **ATS-51**, a high-performance thermal phase-change material. This fills the microscopic air gaps between the component die and the heat sink base to lower thermal impedance. --- ### 3. Application Use Cases This specific model is typically used in the following electronic sectors: * **Telecommunications:** High-speed routers and switches. * **Computing:** Server blade cooling. * **Industrial:** Power supplies and motor controllers where height profile (10mm) is a constraint. ---