The **ATS-P2-134-C1-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ### Technical Specifications The following table summarizes the key physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 4.40°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 70mm x 70mm x 12.7mm | | **Fin Style** | Straight Fin | --- ### Component Breakdown #### 1. Thermal Performance The "C1" in the part number indicates a specific thermal profile. With a thermal resistance of **4.40°C/W**, this heat sink is designed for moderate heat dissipation in environments with active airflow (measured in Linear Feet per Minute or LFM). #### 2. Attachment System (Push-Pins & Springs) The **-R0** suffix refers to the specific attachment kit. * **Push-Pins:** These allow for easy installation without the need for tools. They snap into pre-drilled holes on the Printed Circuit Board (PCB). * **Compression Springs:** These provide a precise amount of downward pressure (clamping force) on the electronic chip, ensuring maximum contact with the thermal interface material (TIM). #### 3. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides increased corrosion resistance and slightly improves radiative heat transfer. #### 4. Geometry The **70mm footprint** makes this a large-format heat sink for the push-pin series. The **low profile (12.7mm)** allows it to fit in "1U" server chassis or thin networking equipment where vertical space is limited. --- ### Applications * **Telecommunications:** Cooling high-speed processors in switches and routers. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Dissipating heat from MOSFET arrays or voltage regulators.