The **ATS-P2-139-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed as a thermal management component for electronic devices like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and thermal interface material. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063-T5) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 25.0 mm x 25.0 mm | | **Height** | 20.0 mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 9.03 °C/W (at 1.0 m/s flow) | | **Thermal Interface (TIM)** | T766 (High performance) | --- ### 2. Key Components & Materials #### A. The Heat Sink Body The body is made from **Aluminum 6063**, which offers a balance between thermal conductivity and structural strength. The "Blue Anodized" finish isn't just for aesthetics; it provides corrosion resistance and increases surface emissivity, slightly improving radiation cooling. #### B. Fin Design (Straight Fin) The fins are designed for directional airflow. This specific model uses a straight-fin pattern, which is ideal for systems with a dedicated fan or a clear path for forced convection. #### C. Push-Pin Attachment Instead of using messy thermal glues or adhesive tapes, this unit uses a **Push-Pin** system with a compression spring. * **Benefits:** It provides consistent downward pressure (roughly 10-20 PSI) on the component, ensuring the best possible contact with the thermal interface material. * **Security:** It is more vibration-resistant than adhesive methods. #### D. Thermal Interface Material (TIM) The "R0" at the end of the part number indicates the presence of a pre-applied **T766** thermal pad. This is a "Phase Change" or high-performance material that fills the microscopic air gaps between the heat sink and the electronic chip. --- ### 3. Application Use Cases The ATS-P2-139-C1-R0 is typically used for: 1. **Small Form Factor PCBs:** Due to its 25x25mm footprint. 2. **FPGA/ASIC Cooling:** Protecting high-frequency chips from thermal throttling. 3. **Embedded Systems:** Used in industrial PCs where mechanical mounting (push-pins) is preferred over adhesives for longevity.