The part number **ATS-P2-165-C1-R0** refers to a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series, designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 18.28°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Type** | Straight Fin | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the component's features: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **P2**: Refers to the specific series of the push-pin attachment mechanism. * **165**: The specific model identifier within the 45mm x 45mm footprint series. * **C1**: Indicates the color/finish (typically Blue Anodized). * **R0**: Refers to the revision code or packaging standards (RoHS compliant). --- ### 3. Key Electronic Cooling Features #### A. Thermal Interface Material (TIM) The bottom of this heat sink usually comes pre-applied with **ATS-PPS-11**, a high-performance phase-change thermal interface material. This ensures there are no air gaps between the chip and the aluminum, maximizing heat transfer. #### B. Push-Pin Mounting Unlike adhesive-based heat sinks, the push-pin mechanism provides: * **Reliable Pressure:** The compression springs ensure a constant force is applied to the chip, improving thermal contact. * **Security:** Mechanical fastening is more vibration-resistant than thermal tape. * **Ease of Maintenance:** It can be removed and re-installed more easily than epoxied sinks. #### C. Airflow Optimization The straight-fin design is optimized for **forced-air cooling**. While it can work in natural convection environments, its performance scales significantly as airflow (LFM - Linear Feet per Minute) increases from the system fans. --- ### 4. Common Applications * **Networking Equipment:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Cooling MOSFETs or power regulators that require a 45mm footprint.