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  • ATS-P2-171-C1-R0

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    The **ATS-P2-171-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed to provide high-efficiency cooling for electronic components like BGAs, CPUs, and GPUs. --- ### 1. Technical Specifications Below are the primary technical parameters of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm | | **Thermal Resistance** | 7.28°C/W @ 200 LFM | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | NO TIM (Standard) | --- ### 2. Key Electronic & Mechanical Features #### A. The maxiFLOW™ Design The "P2" in the part number indicates a specific fin geometry. The maxiFLOW design features a spread fin structure that increases the surface area and maximizes air intake, reducing the thermal resistance of the electronic package it is attached to. #### B. pushPIN™ Attachment System Instead of using adhesive tapes or clips, this unit uses a **pushPIN™** system: * **Secure Fit:** Ensures uniform pressure across the electronic component for maximum heat transfer. * **Reliability:** Brass pins and stainless steel springs provide a robust mechanical connection that can withstand vibration and shock. #### C. Heat Dissipation Efficiency This heat sink is optimized for "forced air" environments. Its efficiency is measured by thermal resistance: * At **100 LFM** (Linear Feet per Minute): ~11.5°C/W * At **700 LFM**: ~4.1°C/W * Lower resistance means the component stays cooler under heavy electrical loads. --- ### 3. Typical Applications In electronic circuit design, the ATS-P2-171-C1-R0 is commonly used for: * **Network Switches/Routers:** Cooling high-speed processors. * **Embedded Systems:** Managing heat in compact industrial PC enclosures. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. ---
    ✨ Follow-up Questions
    • ⤷ What are the different mounting hole requirements for the pushPIN system?
    • ⤷ How does the 'Black Anodized' finish affect thermal performance compared to bare aluminum?
    • ⤷ Can this heat sink be customized with pre-applied Thermal Interface Material (TIM)?