ATS-P2-171-C1-R0
AI

The **ATS-P2-171-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed to provide high-efficiency cooling for electronic components like BGAs, CPUs, and GPUs.
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### 1. Technical Specifications
Below are the primary technical parameters of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Black Anodized) |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm |
| **Thermal Resistance** | 7.28°C/W @ 200 LFM |
| **Attachment Method** | pushPIN™ (Brass Pins) |
| **Spring Type** | Compression Spring |
| **Thermal Interface Material (TIM)** | NO TIM (Standard) |
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### 2. Key Electronic & Mechanical Features
#### A. The maxiFLOW™ Design
The "P2" in the part number indicates a specific fin geometry. The maxiFLOW design features a spread fin structure that increases the surface area and maximizes air intake, reducing the thermal resistance of the electronic package it is attached to.
#### B. pushPIN™ Attachment System
Instead of using adhesive tapes or clips, this unit uses a **pushPIN™** system:
* **Secure Fit:** Ensures uniform pressure across the electronic component for maximum heat transfer.
* **Reliability:** Brass pins and stainless steel springs provide a robust mechanical connection that can withstand vibration and shock.
#### C. Heat Dissipation Efficiency
This heat sink is optimized for "forced air" environments. Its efficiency is measured by thermal resistance:
* At **100 LFM** (Linear Feet per Minute): ~11.5°C/W
* At **700 LFM**: ~4.1°C/W
* Lower resistance means the component stays cooler under heavy electrical loads.
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### 3. Typical Applications
In electronic circuit design, the ATS-P2-171-C1-R0 is commonly used for:
* **Network Switches/Routers:** Cooling high-speed processors.
* **Embedded Systems:** Managing heat in compact industrial PC enclosures.
* **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.
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- ⤷
What are the different mounting hole requirements for the pushPIN system?
- ⤷ How does the 'Black Anodized' finish affect thermal performance compared to bare aluminum?
- ⤷ Can this heat sink be customized with pre-applied Thermal Interface Material (TIM)?