The **ATS-P2-176-C1-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" thermal management series designed to cool electronic components like CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications The model number encodes specific physical and thermal characteristics: | Property | Value / Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 4.38°C/W (at 100 LFM) | | **Flow Orientation** | Vertical or Horizontal (Fine Pitch) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within PCB constraints without interfering with neighboring components. | Dimension | Measurement | | :--- | :--- | | **Length (A)** | 35.00 mm | | **Width (B)** | 35.00 mm | | **Height (C)** | 15.00 mm | | **Pin Pitch (E)** | 40.00 mm | | **Pin Pitch (F)** | 40.00 mm | --- ### 3. Key Electronic/Thermal Features * **Fine-Pitch Design:** The "Straight Fin" geometry provides a high surface area-to-volume ratio, which is ideal for high-velocity airflow environments. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766**, a high-performance thermal grease that ensures minimal air gaps between the component and the heat sink. * **pushPIN™ Attachment:** Instead of messy adhesives or simple clips, it uses a spring-loaded mechanism. This provides: * **Consistent Pressure:** Ensures the heat sink is firmly pressed against the chip for maximum heat transfer. * **Secure Fit:** Prevents the heat sink from shifting during vibration or shipping. --- ### 4. Implementation Example (Mechanical Integration) When designing a PCB for this part, the mounting holes must be placed exactly 40mm apart. In a thermal simulation, the airflow (LFM) significantly impacts performance: ```markdown Airflow Velocity (LFM) | Thermal Resistance (°C/W) -----------------------|-------------------------- 100 (0.5 m/s) | 4.38 300 (1.5 m/s) | 2.40 500 (2.5 m/s) | 1.80 ``` ---