The **ATS-P2-187-C1-R0** is a high-performance electronic thermal management component, specifically a **push-pin style heat sink** designed by Advanced Thermal Solutions (ATS). It is engineered for cooling integrated circuits (ICs) and surface-mount devices (SMD) in high-airflow environments. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (High Thermal Conductivity) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Thermal Resistance** | 10.67°C/W @ 100 LFM (Linear Feet per Minute) | | **Attachment Method** | Push-Pin (Plastic) with Compression Spring | | **Fin Style** | Straight Fin | | **Thermal Interface Material** | Pre-applied Phase Change Material (T766) | --- ### 2. Key Electronic & Mechanical Components #### A. Thermal Interface Material (TIM) The "C1" in the part number indicates the inclusion of **T766 phase-change material**. - **Function:** It fills microscopic air gaps between the heat source (CPU/FPGA) and the aluminum base. - **Benefit:** Reduces contact resistance, ensuring maximum heat transfer efficiency. #### B. Push-Pin Attachment System The "P2" designation refers to the attachment mechanism: - **Plastic Push-Pins:** Used to secure the heat sink to pre-drilled holes in the PCB. - **Spring Loading:** Provides consistent, high pressure across the component surface, which is critical for maintaining thermal performance under vibration or thermal expansion. #### C. Straight-Fin Geometry - **Design:** The fins are aligned in a single direction. - **Application:** Ideal for **uni-directional airflow** (e.g., inside a server chassis or network switch). It offers low pressure drop while maximizing surface area for heat dissipation. --- ### 3. Usage Context This part is commonly found in the following electronic systems: 1. **Networking Hardware:** Cooling ASICs in switches and routers. 2. **Embedded Systems:** Dissipating heat from high-speed microprocessors. 3. **Power Electronics:** Managing thermals for voltage regulator modules (VRMs). ---