The **ATS-P2-195-C3-R0** is a high-performance thermal management component, specifically a **Heat Sink** from the "pushPIN™" series manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its specifications and electronic/mechanical characteristics. --- ### 1. General Specifications This part is designed for cooling electronic components such as CPUs, GPUs, or high-power transistors on a PCB. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-P2-195-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Interface (TIM)** | T412 (High performance) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the allocated board space without interfering with neighboring electronic parts. | Dimension | Value (mm) | | :--- | :--- | | **Length/Width** | 40.00 mm x 40.00 mm | | **Height** | 12.00 mm | | **Pitch (Hole spacing)** | 45.00 mm | | **Fin Type** | XCUT (Cross-cut for multi-directional airflow) | --- ### 3. Thermal Performance Thermal resistance determines how effectively the part moves heat away from the semiconductor junction. It is measured in degrees Celsius per Watt (°C/W). | Airflow Velocity (LFM) | Thermal Resistance (Unducted) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 11.12 °C/W | | **300 LFM (1.5 m/s)** | 6.07 °C/W | | **500 LFM (2.5 m/s)** | 4.87 °C/W | | **700 LFM (3.5 m/s)** | 4.20 °C/W | --- ### 4. Key Electronic Design Features * **XCUT Fin Design:** Unlike straight-fin heat sinks, the XCUT pattern allows air to enter from any direction. This is ideal for electronic enclosures where airflow direction might be turbulent or inconsistent. * **pushPIN™ Attachment:** Uses a brass or plastic pin with a compressed spring. This ensures a consistent **Pressure (Force)** is applied to the electronic component, which optimizes the contact with the Thermal Interface Material (TIM). * **T412 TIM:** This heat sink comes pre-applied with T412 thermal grease. This eliminates the need for manual application during assembly, reducing the risk of air gaps that cause electronic overheating. * **Non-Conductive Finish:** The blue anodized coating provides a layer of protection against corrosion and minor electrical isolation, though it should not be relied upon as a primary dielectric. ---