ATS-X53330P-C1-R0
AI

The **ATS-X53330P-C1-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "superGRIP" series, designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs.
### 1. Technical Specifications
The following table summarizes the primary physical and thermal characteristics of this part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (typically Blue Anodized) |
| **Dimensions (L x W x H)** | 33mm x 33mm x 17.5mm |
| **Attachment Method** | superGRIP™ Clip (No holes required) |
| **Fin Style** | Straight Fin (Extrusion) |
| **Thermal Resistance** | ~4.10 °C/W (at 200 LFM) |
| **Compliance** | RoHS Compliant |
---
### 2. Key Components & Technologies
#### A. The Heat Sink Body
The body is made of **extruded aluminum**, which provides a balance between weight and thermal conductivity. The straight fin design is optimized for environments where there is a consistent, unidirectional airflow.
#### B. superGRIP™ Attachment System
This is the most critical "electronic part" of the assembly. It consists of:
* **Plastic Frame Clip:** A high-strength plastic frame that snaps onto the component (BGA/FPGA) without requiring holes in the PCB.
* **Metal Spring Clip:** A "cobra" shaped spring clip that applies precise, uniform pressure (downward force) on the heat sink to ensure maximum contact with the component.
#### C. Thermal Interface Material (TIM)
The "R0" suffix usually indicates that the heat sink comes pre-applied with a **Thermal Phase Change Material** or a high-performance thermal pad. This ensures that the microscopic gaps between the chip and the heat sink are filled, minimizing thermal resistance.
---
### 3. Application Use Cases
This specific part is used in environments where PCB space is at a premium and mechanical drilling for screws is not possible. Common industries include:
* **Telecommunications:** Network switches and routers.
* **Automotive:** ADAS processing units.
* **Computing:** High-speed server boards and specialized expansion cards.
---
- ⤷
What are the advantages of the superGRIP attachment over traditional push-pins?
- ⤷ How does the thermal resistance of this unit change with different airflow speeds?
- ⤷ Is this heat sink compatible with lead-free soldering processes?