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  • ATS-X53330P-C1-R0

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    The **ATS-X53330P-C1-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "superGRIP" series, designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs. ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (typically Blue Anodized) | | **Dimensions (L x W x H)** | 33mm x 33mm x 17.5mm | | **Attachment Method** | superGRIP™ Clip (No holes required) | | **Fin Style** | Straight Fin (Extrusion) | | **Thermal Resistance** | ~4.10 °C/W (at 200 LFM) | | **Compliance** | RoHS Compliant | --- ### 2. Key Components & Technologies #### A. The Heat Sink Body The body is made of **extruded aluminum**, which provides a balance between weight and thermal conductivity. The straight fin design is optimized for environments where there is a consistent, unidirectional airflow. #### B. superGRIP™ Attachment System This is the most critical "electronic part" of the assembly. It consists of: * **Plastic Frame Clip:** A high-strength plastic frame that snaps onto the component (BGA/FPGA) without requiring holes in the PCB. * **Metal Spring Clip:** A "cobra" shaped spring clip that applies precise, uniform pressure (downward force) on the heat sink to ensure maximum contact with the component. #### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the heat sink comes pre-applied with a **Thermal Phase Change Material** or a high-performance thermal pad. This ensures that the microscopic gaps between the chip and the heat sink are filled, minimizing thermal resistance. --- ### 3. Application Use Cases This specific part is used in environments where PCB space is at a premium and mechanical drilling for screws is not possible. Common industries include: * **Telecommunications:** Network switches and routers. * **Automotive:** ADAS processing units. * **Computing:** High-speed server boards and specialized expansion cards. ---
    ✨ Follow-up Questions
    • ⤷ What are the advantages of the superGRIP attachment over traditional push-pins?
    • ⤷ How does the thermal resistance of this unit change with different airflow speeds?
    • ⤷ Is this heat sink compatible with lead-free soldering processes?