The **CFL252018SF-R82** is a surface-mount (SMD) power inductor commonly used in compact electronic devices. This part follows specific naming conventions established by manufacturers like Bourns or TDK. ### 1. Part Number Breakdown Understanding the nomenclature helps identify its physical and electrical characteristics: | Code Segment | Meaning | Description | | :--- | :--- | :--- | | **CFL** | Series Type | Wire-wound chip inductor for power/signal lines. | | **252018** | Case Size | Dimensions: 2.5mm x 2.0mm x 1.8mm. | | **SF** | Compliance | RoHS compliant and Halogen-free. | | **R82** | Inductance Value | **0.82 µH** (R denotes decimal point). | | **K/M/J** | Tolerance | (Usually appended) K=±10%, M=±20%. | --- ### 2. Key Electrical Specifications While specific datasheets may vary slightly between brands, a typical 0.82µH inductor in this footprint exhibits these characteristics: * **Inductance:** 0.82 µH (Microhenries). * **DC Resistance (DCR):** Generally low, typically ranging from **0.10 to 0.25 Ohms** to minimize power loss. * **Rated Current:** Usually handles between **400mA to 800mA** (depending on the specific sub-series and temperature rise). * **Self-Resonant Frequency (SRF):** High SRF, often above **100 MHz**, making it suitable for high-frequency filtering. * **Operating Temperature:** Typically rated for **-40°C to +125°C**. --- ### 3. Construction and Material * **Core Material:** Ferrite core. Ferrite provides high permeability and low eddy current losses, ideal for efficient power conversion. * **Winding:** Wire-wound construction. This offers a higher Q-factor (quality factor) and better current handling compared to multilayer ceramic inductors of the same size. * **Termination:** Tin-plated copper electrodes for reliable soldering during the SMT reflow process. --- ### 4. Common Applications Due to its small footprint and 0.82µH inductance, this component is found in: 1. **DC-DC Converters:** Used in buck or boost converters for smartphones, tablets, and wearables. 2. **EMI Suppression:** Filtering high-frequency noise in power supply lines. 3. **RF Circuits:** Decoupling and matching networks in communication modules. 4. **Power Management Integrated Circuits (PMICs):** General-purpose energy storage. ---