The **CM252016-R68M** is a surface-mount (SMD) wire-wound chip inductor commonly used in high-frequency circuits. It is part of the "2520" series, which refers to its physical dimensions (metric). --- ### 1. Part Number Breakdown Understanding the alphanumeric code helps identify the technical specifications: | Segment | Code | Description | | :--- | :--- | :--- | | **Series** | CM | Chip Inductor (Wire-wound) | | **Size** | 252016 | Dimensions: 2.5mm x 2.0mm x 1.6mm | | **Inductance** | R68 | 0.68 µH (Microhenries) | | **Tolerance** | M | ±20% | --- ### 2. Technical Specifications These components are designed for stability and performance in RF and power management applications. * **Inductance:** 0.68 µH * **Tolerance:** ±20% (Standard for general-purpose inductors) * **Construction:** Wire-wound on a ceramic or ferrite core. * **Operating Temperature:** Typically ranges from -40°C to +125°C. * **Q Factor:** High Q (Quality factor) at high frequencies, meaning low energy loss. --- ### 3. Key Applications Because of its small footprint and wire-wound design, the CM252016-R68M is typically found in: 1. **Mobile Communications:** Filtering and matching circuits in smartphones and tablets. 2. **RF Modules:** Used in Bluetooth, Wi-Fi, and GPS modules for signal integrity. 3. **DC/DC Converters:** Small-scale power conversion for portable electronics. 4. **Signal Isolation:** Preventing high-frequency noise from entering sensitive parts of a PCB. --- ### 4. Advantages & Characteristics * **High Resonance Frequency (SRF):** Due to the wire-wound structure, it can operate efficiently at high frequencies. * **Solderability:** Features high resistance to soldering heat, making it ideal for automated SMT (Surface Mount Technology) assembly. * **Small Form Factor:** The 1008 (Imperial) / 2520 (Metric) size allows for high-density board designs. ---