CS160808-R47K
AI

## Technical Overview: CS160808-R47K
The **CS160808-R47K** is a surface-mount multi-layer ceramic chip inductor. These components are primarily used for high-frequency applications, signal conditioning, and noise suppression in compact electronic devices.
---
### 1. Part Number Breakdown
Understanding the nomenclature helps identify the physical and electrical characteristics of the component:
| Code Segment | Meaning | Description |
| :--- | :--- | :--- |
| **CS** | Series Type | Multi-layer Chip Inductor (Ceramic) |
| **160808** | Dimensions (L x W x T) | 1.6mm x 0.8mm x 0.8mm (Metric 1608 / EIA 0603) |
| **R47** | Inductance Value | 0.47 µH (Microhenries) |
| **K** | Tolerance | ±10% |
---
### 2. Key Specifications
The following table summarizes the typical electrical performance for this specific part:
| Parameter | Value |
| :--- | :--- |
| **Inductance** | 0.47 µH |
| **Tolerance** | ±10% |
| **Q Factor (Min)** | 15 - 25 (at specified frequency) |
| **DC Resistance (DCR) Max** | ~0.70 - 0.95 Ω |
| **Rated Current (Idc)** | ~100mA - 200mA |
| **Self-Resonant Frequency (SRF)** | ~100 MHz - 150 MHz |
| **Operating Temperature** | -55°C to +125°C |
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### 3. Construction and Material
* **Body Material:** Multi-layer ceramic structure. Unlike wire-wound inductors, these are constructed by layering conductive paste and ceramic material, then firing them into a monolithic block.
* **Termination:** Usually features a nickel barrier with a tin (Sn) plating to ensure excellent solderability and resistance to leaching during the reflow process.
* **Magnetic Shielding:** The multi-layer structure provides a closed magnetic circuit, resulting in low magnetic leakage and high density mounting without crosstalk.
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### 4. Common Applications
Due to its small footprint (**0603 EIA size**) and inductance value, it is commonly found in:
* **RF Circuits:** Matching networks and high-frequency filtering.
* **Mobile Devices:** Smartphones, tablets, and wearable tech where space is at a premium.
* **Decoupling:** Filtering high-frequency noise from power supply lines to sensitive ICs.
* **Signal Lines:** Maintaining signal integrity in high-speed data communication.
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### 5. Schematic Representation
In a circuit diagram, it is represented by the standard inductor symbol:
```text
L1
----(UUU)----
0.47uH
```
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- ⤷What is the difference between a multi-layer inductor and a wire-wound inductor?
- ⤷ How does the 'Q factor' affect the performance of this inductor?
- ⤷ What are the recommended soldering profiles for 0603 ceramic components?