Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • CS160808-R47K

  • AI
    ## Technical Overview: CS160808-R47K The **CS160808-R47K** is a surface-mount multi-layer ceramic chip inductor. These components are primarily used for high-frequency applications, signal conditioning, and noise suppression in compact electronic devices. --- ### 1. Part Number Breakdown Understanding the nomenclature helps identify the physical and electrical characteristics of the component: | Code Segment | Meaning | Description | | :--- | :--- | :--- | | **CS** | Series Type | Multi-layer Chip Inductor (Ceramic) | | **160808** | Dimensions (L x W x T) | 1.6mm x 0.8mm x 0.8mm (Metric 1608 / EIA 0603) | | **R47** | Inductance Value | 0.47 µH (Microhenries) | | **K** | Tolerance | ±10% | --- ### 2. Key Specifications The following table summarizes the typical electrical performance for this specific part: | Parameter | Value | | :--- | :--- | | **Inductance** | 0.47 µH | | **Tolerance** | ±10% | | **Q Factor (Min)** | 15 - 25 (at specified frequency) | | **DC Resistance (DCR) Max** | ~0.70 - 0.95 Ω | | **Rated Current (Idc)** | ~100mA - 200mA | | **Self-Resonant Frequency (SRF)** | ~100 MHz - 150 MHz | | **Operating Temperature** | -55°C to +125°C | --- ### 3. Construction and Material * **Body Material:** Multi-layer ceramic structure. Unlike wire-wound inductors, these are constructed by layering conductive paste and ceramic material, then firing them into a monolithic block. * **Termination:** Usually features a nickel barrier with a tin (Sn) plating to ensure excellent solderability and resistance to leaching during the reflow process. * **Magnetic Shielding:** The multi-layer structure provides a closed magnetic circuit, resulting in low magnetic leakage and high density mounting without crosstalk. --- ### 4. Common Applications Due to its small footprint (**0603 EIA size**) and inductance value, it is commonly found in: * **RF Circuits:** Matching networks and high-frequency filtering. * **Mobile Devices:** Smartphones, tablets, and wearable tech where space is at a premium. * **Decoupling:** Filtering high-frequency noise from power supply lines to sensitive ICs. * **Signal Lines:** Maintaining signal integrity in high-speed data communication. --- ### 5. Schematic Representation In a circuit diagram, it is represented by the standard inductor symbol: ```text L1 ----(UUU)---- 0.47uH ``` ---
    ✨ Follow-up Questions
    • ⤷What is the difference between a multi-layer inductor and a wire-wound inductor?
    • ⤷ How does the 'Q factor' affect the performance of this inductor?
    • ⤷ What are the recommended soldering profiles for 0603 ceramic components?