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  • CS321613-R47K

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    The **CS321613-R47K** is a surface-mount multilayer chip inductor. It is a passive electronic component designed to store energy in a magnetic field, typically used for noise filtering and signal conditioning in compact electronic circuits. ### 1. Part Number Breakdown Understanding the nomenclature helps identify the physical and electrical characteristics: | Code | Meaning | Description | | :--- | :--- | :--- | | **CS** | Series | Multilayer Chip Inductor | | **3216** | Size (Metric) | 3.2mm x 1.6mm (Equivalent to **1206** Imperial size) | | **13** | Thickness | Approximately 1.3mm | | **R47** | Inductance Value | 0.47 µH (Microhenries) | | **K** | Tolerance | ±10% | --- ### 2. Technical Specifications The typical electrical parameters for this class of inductor are as follows: * **Inductance:** 0.47 µH * **Tolerance:** ±10% * **Test Frequency:** Usually measured at 25 MHz * **DC Resistance (DCR):** Low (typically < 0.30 Ω) to minimize power loss. * **Rated Current:** The maximum current it can handle before overheating or saturating (typically 200mA - 300mA for this size). * **Operating Temperature:** Generally -55°C to +125°C. --- ### 3. Key Features and Construction * **Multilayer Technology:** Unlike wire-wound inductors, these are made by layering conductive paste and ceramic material. This results in a monolithic, solid structure that is highly reliable. * **Magnetic Shielding:** The closed magnetic circuit minimizes crosstalk and electromagnetic interference (EMI) with surrounding components. * **Solderability:** Features nickel-barrier terminations with a tin plating layer, making it compatible with both flow and reflow soldering processes. --- ### 4. Applications This component is commonly found in: 1. **Mobile Electronics:** Smartphones and tablets for power supply decoupling. 2. **EMI Suppression:** Filtering high-frequency noise in signal lines. 3. **Computer Peripherals:** Used in motherboards and video cards to stabilize voltage. 4. **Communication Equipment:** Small-scale RF circuits and Bluetooth modules.
    ✨ Follow-up Questions
    • ⤷ What is the difference between a multilayer inductor and a wire-wound inductor?
    • ⤷ How does the 1206 package size affect PCB layout requirements?
    • ⤷ Can this inductor be used in high-current power applications?