The **CTMC1008F-R056K** is a high-frequency, surface-mount (SMD) molded chip inductor. It belongs to the wire-wound ceramic core category, designed specifically for signal processing and RF (Radio Frequency) applications where stability and high resonance are required. --- ### 1. Part Number Breakdown Understanding the alphanumeric code helps identify the component's physical and electrical characteristics: | Code Segment | Meaning | Description | | :--- | :--- | :--- | | **CTMC** | Series | Molded Chip Inductor (Wire-wound) | | **1008** | Case Size | 1.0 x 0.8 inches (Approx. 2.5 x 2.0 mm) | | **F** | Lead-Free | RoHS Compliant / Environmental Standard | | **R056** | Inductance Value | 0.056 µH (or 56 nH) | | **K** | Tolerance | ±10% | --- ### 2. Technical Specifications The electrical performance of this inductor is optimized for high-speed circuitry: * **Inductance:** 0.056 µH (56 nH) * **Tolerance:** ±10% * **Test Frequency:** Typically measured at 25.2 MHz. * **Quality Factor (Q):** High Q value (typically 15-30), which indicates low energy loss relative to the energy stored. * **Self-Resonant Frequency (SRF):** Very high, usually above 1000 MHz, allowing it to function effectively in RF ranges. * **Rated DC Current (Idc):** Generally ranges between 300mA to 700mA depending on specific manufacturer thermal limits. * **DC Resistance (DCR):** Low resistance (typically <0.5 Ohms) to minimize heat dissipation. --- ### 3. Physical Construction The "M" in the series often denotes a **Molded** construction: 1. **Core Material:** Usually a ceramic or ferrite core. For low values like 56nH, ceramic is standard to ensure high SRF. 2. **Encapsulation:** The wire-wound element is encapsulated in a hard epoxy resin. This provides superior mechanical strength and protection against environmental factors (moisture, vibration). 3. **Terminations:** Solder-plated copper or silver-nickel-tin electrodes for surface mounting. --- ### 4. Common Applications Due to its small footprint and high-frequency stability, it is found in: * **Telecommunications:** Mobile phones, GPS receivers, and Wi-Fi modules. * **RF Circuits:** Matching networks, filters, and oscillators. * **Computer Peripherals:** High-speed data lines and EMI suppression.