The **DFE201210U-R68M#** is a high-performance power inductor manufactured by **Murata Manufacturing Co., Ltd.** It is part of the DFE series, which utilizes metal alloy materials to achieve high current ratings in a miniature footprint. --- ### 1. General Specifications This component is primarily used in DC-DC converters for power management in mobile electronics. | Parameter | Value | | :--- | :--- | | **Inductance** | 0.68 µH | | **Tolerance** | ±20% (M) | | **Case Size (Metric)** | 2012 (2.0 x 1.2 mm) | | **Height (Max)** | 1.0 mm | | **DC Resistance (Max)** | 35 mΩ | | **Rated Current (Isat)** | 3.9 A (Based on Inductance change) | | **Rated Current (Itemp)** | 3.1 A (Based on Temperature rise) | | **Operating Temperature** | -40°C to 125°C | --- ### 2. Key Features and Construction * **Metal Alloy Core:** Unlike traditional ferrite inductors, this part uses a metal powder core. This provides **soft saturation characteristics**, meaning the inductance drops gradually as current increases rather than dropping sharply. * **Magnetic Shielding:** The molded construction naturally provides magnetic shielding, reducing Electromagnetic Interference (EMI) with surrounding components. * **Compact Low Profile:** The "2012" size (0805 in inches) with a 1.0mm height is optimized for space-constrained devices like smartphones, tablets, and wearables. * **High Current Handling:** Despite its small size, the metal alloy allows it to handle significantly higher currents than standard ferrite chips of the same dimensions. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Code | Meaning | | :--- | :--- | | **DFE** | Series Name (Metal Alloy Power Inductor) | | **201210** | Dimensions (2.0mm x 1.2mm x 1.0mm) | | **U** | Product Internal Code | | **R68** | Inductance Value (R68 = 0.68 µH) | | **M** | Tolerance (M = ±20%) | | **#** | Packaging/Special Specification Code | --- ### 4. Typical Applications 1. **Smartphones/Tablets:** Used in the POL (Point of Load) circuits for CPUs and GPUs. 2. **Wearables:** Ideal for smartwatches due to the ultra-low profile. 3. **Communication Modules:** Power supply lines for Wi-Fi and Bluetooth chips. 4. **SSD/Storage:** Power management for high-speed data drives.